[Product Features]
• M.2 2280 form factor
• Compliant with PCI Express Base Specification Revision 4 standard with Gen4x4 8GB/s bandwidth.
• SMART Toolbox for Windows and Linux. - Compliant with NVME 2.0 command protocol.
• Built-in-Voltage detector for power shielding protection
• Enhanced Data reliability with LDPC ECC Protection
• Global wear leveling algorithm evens program/erase count
• Early weak block retirement - Supports SMART feature command set.
• Built-in temperature sensor (Thermal Throttling) function to adjust access speed of NAND flash and keep the SSD system stable.
• Supports with Dynamic SLC architecture to keep optimized performance.
• Optional Conformal Coating
• Standard IPC A-610E
• Power shielding firmware architecture protection when sensing unstable voltage and power down to stop receiving host commands.
• Supports PCIe L1.2 low power mode
• Support AES/TCG-OPAL 2.0

[Product Specifications]
• Dimension: 3.15 x 0.87 x 0.14 inch
• Weight: 0.28 oz/ 0.018 lb
• Form Factor: M.2 2280
• Interface: PCIe Gen4 x4,  backward compatible with PCIe Gen1 & PCIe Gen2 & Gen3
• ECC Capability: Hardware LDPC ECC engine and Block/Page RAID
• MTBF: >3,000,000 hrs @25°C (MIL-HDBK-217F part count method Telcordia SR-332 Method)
• Program / Erase Endurance: 3,000 P/E cycles
• Optimal sustained performance: Dynamic SLC Cache Architecture
• Data Endurance & Data integrity: Early weak block retirement, Global Wear leveling
• Data Retention: *
- 10% of program / Erase Endurance cycles: 10 Years
- 100% of program / Erase Endurance cycles: 1 Years
• Performance: (Maximum Read/Write)
-128GB: 1550/860 MB/s
-256GB: 3040/1570 MB/s
-512GB:  4510/3270 MB/s
-1TB: 4660/4330 MB/s
• IOPS:
-128GB: 816K/166K
-256GB: 816K/373K
-512GB: 816K/634K
-1TB: 828K/644K
• Voltage: DC+3.3V ± 5%
• Temperature: -20°C to +75°C (Operating), -55°C to +95°C (Non-Operating)
• Humidity:
• Vibration**: 20G (Peak-to-Peak), 80~2000 Hz
• Shock***: 1,500G, 0.5ms 
• Operating System: Windows 10, Windows Embedded Systems, Linux
• Certification: CE (EN55032 & EN55035),  FCC Part 15 subpart B, RoHS 2.0 (2011/65/EU & 2015/863/EU)

*The value is based on normal program/erase endurance at room temperature. High environmental temperature may shorten the retention period.
**Duration:30 min x 3 axis
***1500G, 0.5msec, half-sine wave, 3times in each direction, total=18times (6 directions)